DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 770
DF2552BR26DV
Manufacturer Part Number
DF2552BR26DV
Description
IC H8S/2552 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Specifications of DF2552BR26DV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2552BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 20 Flash Memory
Table 20.9 (3)
Rev. 6.00 Sep. 24, 2009 Page 722 of 928
REJ09B0099-0600
Item
Execution of Erasure
Determination of
Erasure Result
Operation for Erasure
Error
Operation for FKEY
Clear
Item
Storage Area for
Program Data
Operation for Selection
of On-chip Program to
be Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SCO = 1 to FCCS
(Download)
Operation for FKEY
Clear
Determination of
Download Result
Operation for Download
Error
Operation for Settings
of Initial Parameter
Useable Area for Programming in User Boot Mode
On-Chip
RAM
On-Chip
RAM
Storable/Executable Area
Storable /Executable Area
Target Flash
Memory
User Boot
MAT
×
×
×
×
×*
×
1
External Space
(Expanded Mode) User MAT
User MAT
⎯
×
User Boot
MAT
⎯
Selected MAT
Selected MAT
Embedded
Program
Storage Area
Embedded
Program
Storage Area
⎯
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