DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 190
DF2552BR26DV
Manufacturer Part Number
DF2552BR26DV
Description
IC H8S/2552 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Specifications of DF2552BR26DV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2552BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 7 Bus Controller
On-Chip IEB Module Access Timing (H8S/2552 Group Only): On-chip IEB module is
accessed in four states. At this time, the data bus width is 8 bits. Figure 7.10 shows on-chip IEB
module access timing, and figure 7.11 shows the pin states.
Rev. 6.00 Sep. 24, 2009 Page 142 of 928
REJ09B0099-0600
Figure 7.9 Pin States during On-Chip Port H, Port J, and IIC2 Module Access
φ
Internal address bus
Read
Write
φ
Address bus
AS
RD
HWR, LWR
Data bus
IEB read signal
Internal data bus
IEB write signal
Internal data bus
Figure 7.10 On-Chip IEB Module Access Cycle
T
1
T
1
Retained
High impedance
High
High
High
T
2
Bus cycle
T
2
Bus cycle
Address
Write data
T
3
T
3
T
4
Read data
T
4
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