HD6473837HV Renesas Electronics America, HD6473837HV Datasheet - Page 104
HD6473837HV
Manufacturer Part Number
HD6473837HV
Description
MCU 3/5V 60K PB-FREE 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Lr
Datasheet
1.HD6473837HV.pdf
(562 pages)
Specifications of HD6473837HV
Core Processor
H8/300L
Core Size
8-Bit
Speed
5MHz
Connectivity
SCI
Peripherals
LCD, PWM
Number Of I /o
84
Program Memory Size
60KB (60K x 8)
Program Memory Type
OTP
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 12x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Company:
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ISC
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Company:
Part Number:
HD6473837HV
Manufacturer:
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Connecting a Ceramic Oscillator: Figure 4.4 shows a typical method of connecting a ceramic
oscillator.
Notes on Board Design: When generating clock pulses by connecting a crystal or ceramic
oscillator, pay careful attention to the following points.
Avoid running signal lines close to the oscillator circuit, since the oscillator may be adversely
affected by induction currents. (See figure 4.5.)
The board should be designed so that the oscillator and load capacitors are located as close as
possible to pins OSC
To be avoided
OSC
OSC
Figure 4.4 Typical Connection to Ceramic Oscillator
1
and OSC
Figure 4.5 Board Design of Oscillator Circuit
C
C
1
2
1
2
2
.
R
f
C
C
Signal A Signal B
1
2
R = 1 M
C = 30 pF 10%
C = 30 pF 10%
Ceramic oscillator: Murata
1
2
f
OSC
OSC
20%
1
2
87
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