R4F24268NVRFQV Renesas Electronics America, R4F24268NVRFQV Datasheet - Page 336
R4F24268NVRFQV
Manufacturer Part Number
R4F24268NVRFQV
Description
MCU 256KB FLASH 48K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet
1.R4F24268NVZFQV.pdf
(1406 pages)
Specifications of R4F24268NVRFQV
Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Section 6 Bus Controller (BSC)
When the BREQ pin is driven high, the BACK pin is driven high at the prescribed timing and the
external bus released state is terminated.
If an external bus release request and external access occur simultaneously, the order of priority is
as follows:
If a refresh request*
as follows:
Notes: 1. Not supported by the H8S/2424 Group.
6.12.2
Table 6.14 shows pin states in the external bus released state.
Table 6.14 Pin States in Bus Released State
Note:
Page 306 of 1372
Pins
A23 to A0
D15 to D0
CSn (n = 7 to 0)
UCAS, LCAS
AS/AH
RD
OE
HWR, LWR
DACKn (n = 1, 0)
EDACKn* (n = 3, 2)
2. Not supported by the 5-V version.
*
(High) External bus release > External access by internal bus master (Low)
(High) Refresh*
Pin States in External Bus Released State
Not supported by the H8S/2424 Group.
2
and external bus release request occur simultaneously, the order of priority is
2
> External bus release (Low)
Pin State
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High
High
H8S/2426, H8S/2426R, H8S/2424 Group
REJ09B0466-0350 Rev. 3.50
Jul 09, 2010
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