R4F24268NVRFQV Renesas Electronics America, R4F24268NVRFQV Datasheet - Page 1194
R4F24268NVRFQV
Manufacturer Part Number
R4F24268NVRFQV
Description
MCU 256KB FLASH 48K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet
1.R4F24268NVZFQV.pdf
(1406 pages)
Specifications of R4F24268NVRFQV
Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Section 23 Power-Down Modes
23.5.6
The following points should be noted in clock division mode.
• Select the clock division ratio by the STC1 and STC0 bits so that the frequency of φ is within
• All the on-chip peripheral modules operate on the φ. Therefore, note that the time processing
• Note that the frequency of φ will be changed by changing the clock division ratio.
Page 1164 of 1372
the operation guaranteed range of clock cycle time tcyc shown in the Electrical Characteristics.
In other words, the frequency of φ must be 8 MHz or higher; be careful not so specify φ < 8
MHz.
of modules such as a timer and SCI differ before and after changing the clock division ratio. In
addition, the wait time for clearing software standby mode differs by changing the clock
division ratio.
Notes on Clock Division Mode
H8S/2426, H8S/2426R, H8S/2424 Group
REJ09B0466-0350 Rev. 3.50
Jul 09, 2010
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