R4F24268NVRFQV Renesas Electronics America, R4F24268NVRFQV Datasheet - Page 1172
R4F24268NVRFQV
Manufacturer Part Number
R4F24268NVRFQV
Description
MCU 256KB FLASH 48K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet
1.R4F24268NVZFQV.pdf
(1406 pages)
Specifications of R4F24268NVRFQV
Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Section 22 Clock Pulse Generator
22.4.3
When using the crystal resonator, place the crystal resonator and its load capacitors as close as
possible to the XTAL and EXTAL pins. Other signal lines should be routed away from the
oscillation circuit to prevent induction from interfering with correct oscillation. See figure 22.6.
Figure 22.7 shows the external circuitry recommended for the PLL circuit. Separate PLLVcc and
PLLVss from the other Vcc and Vss lines at the board power supply source, and be sure to insert
bypass capacitors CPB and CB close to the pins.
Page 1142 of 1372
Notes on Board Design
Note: * CB and CPB are laminated ceramic capacitors.
Figure 22.7 Recommended External Circuitry for PLL Circuit
Prohibited
Figure 22.6 Note on Board Design for Oscillation Circuit
PLLV
C
C
PLLV
L2
L1
V
V
CC
CC
SS
SS
Signal A Signal B
CPB: 0.1 µF *
CB: 0.1 µF *
XTAL
EXTAL
This LSI
H8S/2426, H8S/2426R, H8S/2424 Group
REJ09B0466-0350 Rev. 3.50
Jul 09, 2010
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