HD64F3664BPV Renesas Electronics America, HD64F3664BPV Datasheet - Page 427

MCU 3/5V 32K,PB-FREE 42-DIP

HD64F3664BPV

Manufacturer Part Number
HD64F3664BPV
Description
MCU 3/5V 32K,PB-FREE 42-DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3664BPV

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI
Peripherals
PWM, WDT
Number Of I /o
29
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
42-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
The package dimensions that are shows in the Renesas Semiconductor Packages Data Book have
priority.
*Dimension including the plating thickness
Base material dimension
*0.22 ± 0.05
0.20 ± 0.04
49
64
Appendix D Package Dimensions
48
1
12.0 ± 0.2
Figure D.1 FP-64E Package Dimensions
10
0.10
1.25
0.08
33
16
32
17
M
Package Code
JEDEC
EIAJ
Mass (reference value)
Rev. 6.00 Mar. 24, 2006 Page 397 of 412
0.5 ± 0.2
1.0
0° − 8°
FP-64E
Conforms
0.4 g
REJ09B0142-0600
Unit: mm
Appendix

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