TMP86FS28DFG(JZ) Toshiba, TMP86FS28DFG(JZ) Datasheet - Page 267
TMP86FS28DFG(JZ)
Manufacturer Part Number
TMP86FS28DFG(JZ)
Description
IC MCU 8BIT FLASH 60KB 80-LQFP
Manufacturer
Toshiba
Series
TLCS-870/Cr
Datasheet
1.TMP86FS28DFGJZ.pdf
(272 pages)
Specifications of TMP86FS28DFG(JZ)
Core Processor
870/C
Core Size
8-Bit
Speed
16MHz
Connectivity
SIO, UART/USART
Peripherals
LCD, PWM, WDT
Number Of I /o
62
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-LQFP
Processor Series
TLCS-870
Core
870/C
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SIO, UART
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
62
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
BM1040R0A, BMP86A100010A, BMP86A100010B, BMP86A200010B, BMP86A200020A, BMP86A300010A, BMP86A300020A, BMP86A300030A, SW89CN0-ZCC, SW00MN0-ZCC
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
For Use With
BM1401W0A-G - FLASH WRITER ON-BOARD PROGRAMTMP89C900XBG - EMULATION CHIP TMP89F LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
TMP86FS28DFGJZ
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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20.7 Recommended Oscillating Conditions
20.8 Handling Precaution
Note 1: To ensure stable oscillation, the resonator position, load capacitance, etc. must be appropriate. Because these
Note 2: For the resonators to be used with Toshiba microcontrollers, we recommend ceramic resonators manufactured by
- The solderability test conditions for lead-free products (indicated by the suffix G in product name) are shown
- When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we
below.
1. When using the Sn-37Pb solder bath
2. When using the Sn-3.0Ag-0.5Cu solder bath
recommend electrically shielding the package in order to maintain normal operating condition.
factors are greatly affected by board patterns, please be sure to evaluate operation on the board on which the
device will actually be mounted.
Murata Manufacturing Co., Ltd.
For details, please visit the website of Murata at the following URL:
http://www.murata.com
Note: The pass criteron of the above test is as follows:
Solder bath temperature = 230 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
Solder bath temperature = 245 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
C
1) High-frequency Oscillation
1
XIN
Solderability rate until forming ≥ 95 %
XOUT
C
2
Page 255
C
2) Low-frequency Oscillation
XTIN
1
XTOUT
C
2
TMP86FS28DFG
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