LPC3154FET208,551 NXP Semiconductors, LPC3154FET208,551 Datasheet - Page 68

• Manufacturer Part Number: LPC3154FET208,551
• Description: IC ARM9 MCU USB OTG 208TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC3000r

Specifications of LPC3154FET208,551

• Package / Case: 208-TFBGA
• Voltage - Supply (vcc/vdd): 1.1 V ~ 1.3 V
• Operating Temperature: -40°C ~ 85°C
• Speed: 180MHz
• Number Of I /o: 10
• Core Processor: ARM9
• Program Memory Type: External Program Memory
• Ram Size: 192K x 8
• Data Converters: A/D 3x10b
• Oscillator Type: External
• Peripherals: DMA, I²S, LCD, PWM, WDT
• Connectivity: EBI/EMI, I²C, IrDA, MMC, PCM, SPI, UART/USART, USB OTG
• Core Size: 32-Bit
• Processor Series: LPC31
• Core: ARM926EJS
• Data Bus Width: 32 bit
• Data Ram Size: 192 KB
• Interface Type: I2C, I2S, SPI, UART
• Maximum Clock Frequency: 180 MHz
• Number Of Timers: 5
• Operating Supply Voltage: 1.2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935287563551

Fig 24. SDRAM bank activate and write timing
EBI_NRAS_BLOUT
EBI_NCAS_BLOUT
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EBI_A_[15:2]
EBI_D_[15:0]
EBI_CLKOUT
EBI_NDYCS
EBI_DQMx
EBI_NWE
EBI_CKE
EBI_CKE
t
CHCX
T
CLCL
t
CLCX
t
d(o)
t
t
d(o)
d(AV)
ACTIVE
BANK,
ROW
t
t
h(o)
h(A)
t
d(QV)
WRITE
t
COLUMN
QZ
BANK,
DATA
t
h(Q)
t
h(o)
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