LPC3154FET208,551 NXP Semiconductors, LPC3154FET208,551 Datasheet - Page 2

IC ARM9 MCU USB OTG 208TFBGA

LPC3154FET208,551

Manufacturer Part Number
LPC3154FET208,551
Description
IC ARM9 MCU USB OTG 208TFBGA
Manufacturer
NXP Semiconductors
Series
LPC3000r
Datasheet

Specifications of LPC3154FET208,551

Package / Case
208-TFBGA
Voltage - Supply (vcc/vdd)
1.1 V ~ 1.3 V
Operating Temperature
-40°C ~ 85°C
Speed
180MHz
Number Of I /o
10
Core Processor
ARM9
Program Memory Type
External Program Memory
Ram Size
192K x 8
Data Converters
A/D 3x10b
Oscillator Type
External
Peripherals
DMA, I²S, LCD, PWM, WDT
Connectivity
EBI/EMI, I²C, IrDA, MMC, PCM, SPI, UART/USART, USB OTG
Core Size
32-Bit
Processor Series
LPC31
Core
ARM926EJS
Data Bus Width
32 bit
Data Ram Size
192 KB
Interface Type
I2C, I2S, SPI, UART
Maximum Clock Frequency
180 MHz
Number Of Timers
5
Operating Supply Voltage
1.2 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
935287563551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC3154FET208,551
Manufacturer:
Micrel
Quantity:
112
Part Number:
LPC3154FET208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
3. Ordering information
Table 1.
LPC3152_3154
Preliminary data sheet
Type number
LPC3152FET208
LPC3154FET208
Ordering information
Package
Name
TFBGA208 TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls;
TFBGA208 TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls;
System functions
Power supply
Operating voltage and temperature
TFBGA208 package: 12 × 12 mm
Three-channel 10-bit ADC
Integrated 4/8/16-bit 6800/8080 compatible LCD interface
Integrated audio codec with stereo ADC and Class AB headphone amplifier
Dynamic clock gating and scaling
Multiple power domains
Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB
On the LPC3154 only: secure booting using AES decryption engine from SPI flash,
NAND flash, SD/MMC cards, UART, or USB
DMA controller
Four 32-bit timers
Watchdog timer
PWM module
Master/slave PCM interface
Random Number Generator (RNG)
General Purpose I/O (GPIO) pins
Flexible and versatile interrupt structure
JTAG interface with boundary scan and ARM debug access
Real-Time Clock (RTC)
Integrated power supply unit
Li-ion charger
USB charge pump
Core voltage: 1.2 V
I/O voltage: 1.8 V, 3.3 V
Temperature: −40 °C to +85 °C
Description
body 12 x 12 x 0.7 mm
body 12 x 12 x 0.7 mm
All information provided in this document is subject to legal disclaimers.
Rev. 0.12 — 27 May 2010
2
, 0.7 mm pitch
LPC3152/3154
© NXP B.V. 2010. All rights reserved.
Version
sot930-1
sot930-1
2 of 88

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