PIC24HJ256GP610A-I/PF Microchip Technology, PIC24HJ256GP610A-I/PF Datasheet - Page 276
PIC24HJ256GP610A-I/PF
Manufacturer Part Number
PIC24HJ256GP610A-I/PF
Description
IC MCU 16BIT 256KB FLASH 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ64GP206-IPT.pdf
(292 pages)
3.PIC24HJ64GP206A-IMR.pdf
(304 pages)
4.PIC24HJ256GP206A-IMR.pdf
(8 pages)
Specifications of PIC24HJ256GP610A-I/PF
Program Memory Type
FLASH
Program Memory Size
256KB (85.5K x 24)
Package / Case
100-TQFP, 100-VQFP
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
CAN/I2C/SPI/UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Number Of Timers
9
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (32-ch x 12-bit)
Controller Family/series
PIC24
Ram Memory Size
16KB
Cpu Speed
40MIPS
No. Of Timers
9
Embedded Interface Type
CAN, I2C, LIN, SPI, UART
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ256GP610A-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ64GP206-IPT PDF datasheet #2
- PIC24HJ64GP206A-IMR PDF datasheet #3
- PIC24HJ256GP206A-IMR PDF datasheet #4
- Current page: 276 of 304
- Download datasheet (3Mb)
PIC24HJXXXGPX06A/X08A/X10A
25.1
TABLE 25-1:
TABLE 25-2:
TABLE 25-3:
TABLE 25-4:
DS70592B-page 276
High Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
DC CHARACTERISTICS
Operating Voltage
HDC10
DC CHARACTERISTICS
Power-Down Current (I
HDC60e
HDC61c
Note 1:
Parameter
Parameter
Characteristic
No.
No.
2:
3:
4:
Operating Junction Temperature Range
High Temperature DC Characteristics
P
I/O = ({V
Operating Ambient Temperature Range
INT
Base I
pulled to V
The current is the additional current consumed when the module is enabled. This current should be
added to the base I
These currents are measured on the device containing the most memory in this family.
These parameters are characterized, but are not tested in manufacturing.
Supply Voltage
V
= V
Symbol
DD
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD
Typical
DD
250
x (I
is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
3
SS
- V
DD
. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.
PD
OH
- I
)
} x I
Characteristic
Rating
OH
PD
3.0V to 3.6V
V
OH
2000
(in Volts)
Max
DD
)
current.
5
) + (V
—
Range
OL
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
x I
Units
A
A
OL
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
)
Preliminary
Min
3.0
Temperature Range
+140°C
+140°C
-40°C to +140°C
Typ
3.3
(in °C)
-40°C T
Symbol
P
DMAX
Max
3.3V
3.3V
P
T
T
3.6
A
D
J
-40°C T
A
+140°C for High Temperature
Conditions
Units
Min
Base Power-Down Current
Watchdog Timer Current: I
-40
-40
PD
V
A
)
PIC24HJXXXGPX06A/X08A/
+140°C for High Temperature
(T
P
2009 Microchip Technology Inc.
INT
J
-40°C to +140°C
- T
Typ
—
—
+ P
A
)/
Max MIPS
I
/
JA
X10A
O
Conditions
20
+145
+140
Max
(1,3)
WDT (2,4)
Unit
°C
°C
W
W
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