PIC16C66-10I/SP Microchip Technology, PIC16C66-10I/SP Datasheet - Page 296
![IC MCU OTP 8KX14 PWM 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16C66-10I/SP
Manufacturer Part Number
PIC16C66-10I/SP
Description
IC MCU OTP 8KX14 PWM 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC16LC62A-04SP.pdf
(337 pages)
4.PIC16C66-04SO.pdf
(6 pages)
Specifications of PIC16C66-10I/SP
Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
14KB (8K x 14)
Program Memory Type
OTP
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
- PIC16F616T-ISL PDF datasheet
- PIC16F818-ISO PDF datasheet #2
- PIC16LC62A-04SP PDF datasheet #3
- PIC16C66-04SO PDF datasheet #4
- Current page: 296 of 337
- Download datasheet (3Mb)
PIC16C6X
25.6
DS30234D-page 296
Symbol
Base
Plane
Seating
Plane
Pin No. 1
Indicator
Area
D1
A1
A2
A3
B1
E1
e1
eA
eB
S1
C
D
N
A
B
E
S
L
18-Lead Ceramic CERDIP Dual In-line with Window (300 mil) (JW)
B1
B
S
22.352
20.320
0.381
3.810
3.810
0.355
1.270
0.203
7.620
5.588
2.540
7.366
7.620
3.175
0.508
0.381
Min
N
18
0
—
Package Group: Ceramic CERDIP Dual In-Line (CDP)
Millimeters
23.622
20.320
10.160
5.080
1.778
4.699
4.445
0.585
1.651
0.381
8.382
7.874
2.540
8.128
3.810
1.397
1.270
Max
10
18
D
D1
Reference
Reference
Typical
Typical
Typical
Notes
E1 E
S1
e1
0.015
0.150
0.150
0.014
0.050
0.008
0.880
0.800
0.300
0.220
0.100
0.290
0.300
0.125
0.020
0.015
Min
18
0
—
L
A1 A3 A
Inches
A2
1997 Microchip Technology Inc.
0.065
0.015
0.800
0.100
0.320
0.200
0.070
0.185
0.175
0.023
0.930
0.330
0.310
0.400
0.150
0.055
0.050
Max
10
18
e
e
A
B
Reference
Reference
Typical
Typical
Typical
Notes
C
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