PIC16F1947-I/PT Microchip Technology, PIC16F1947-I/PT Datasheet - Page 288
PIC16F1947-I/PT
Manufacturer Part Number
PIC16F1947-I/PT
Description
IC MCU 8BIT FLASH 64TQFP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC16LF1933-ISS.pdf
(46 pages)
3.PIC16LF1946-IPT.pdf
(448 pages)
4.PIC16LF1946-IPT.pdf
(6 pages)
5.PIC16F1946-IPT.pdf
(8 pages)
6.PIC16F1946-EPT.pdf
(440 pages)
Specifications of PIC16F1947-I/PT
Core Size
8-Bit
Program Memory Size
28KB (16K x 14)
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
54
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 17x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Controller Family/series
PIC16F
Eeprom Memory Size
256Byte
Ram Memory Size
1024Byte
Cpu Speed
32MHz
No. Of Timers
5
Interface
EUSART, I2C, SPI
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
EUSART, I2C, SPI
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
54
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 17 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
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Price
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- PIC16F722-ISS PDF datasheet
- PIC16LF1933-ISS PDF datasheet #2
- PIC16LF1946-IPT PDF datasheet #3
- PIC16LF1946-IPT PDF datasheet #4
- PIC16F1946-IPT PDF datasheet #5
- PIC16F1946-EPT PDF datasheet #6
- Current page: 288 of 448
- Download datasheet (4Mb)
PIC16F/LF1946/47
24.6.13.3
Bus collision occurs during a Stop condition if:
a)
b)
FIGURE 24-38:
FIGURE 24-39:
DS41414B-page 288
After the SDAx pin has been deasserted and
allowed to float high, SDAx is sampled low after
the BRG has timed out.
After the SCLx pin is deasserted, SCLx is
sampled low before SDAx goes high.
SDAx
SCLx
PEN
BCLxIF
P
SSPxIF
SDAx
SCLx
PEN
BCLxIF
P
SSPxIF
Bus Collision During a Stop
Condition
BUS COLLISION DURING A STOP CONDITION (CASE 1)
BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDAx asserted low
Assert SDAx
T
BRG
T
BRG
Preliminary
T
BRG
T
BRG
The Stop condition begins with SDAx asserted low.
When SDAx is sampled low, the SCLx pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPxADD and
counts down to 0. After the BRG times out, SDAx is
sampled. If SDAx is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’
sampled low before SDAx is allowed to float high, a bus
collision occurs. This is another case of another master
attempting to drive a data ‘0’
SCLx goes low before SDAx goes high,
set BCLxIF
T
BRG
T
BRG
(Figure
2010 Microchip Technology Inc.
24-37). If the SCLx pin is
(Figure
SDAx sampled
low after T
set BCLxIF
’0’
’0’
’0’
’0’
24-38).
BRG
,
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