MCIMX253DJM4 Freescale Semiconductor, MCIMX253DJM4 Datasheet - Page 149

IC MPU IMX25 COMM 400MAPBGA

MCIMX253DJM4

Manufacturer Part Number
MCIMX253DJM4
Description
IC MPU IMX25 COMM 400MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX25r
Datasheet

Specifications of MCIMX253DJM4

Core Processor
ARM9
Core Size
32-Bit
Speed
400MHz
Connectivity
1-Wire, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
External Program Memory
Ram Size
144K x 8
Voltage - Supply (vcc/vdd)
1.15 V ~ 1.52 V
Data Converters
A/D 3x12b
Oscillator Type
External
Operating Temperature
-20°C ~ 70°C
Package / Case
400-MAPBGA
Processor To Be Evaluated
i.MX253
Processor Series
i.MX253
Interface Type
SSI
Core
ARM926EJS
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
- 20 C
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX253DJM4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCIMX253DJM4A
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCIMX253DJM4A
0
Table 106
4.8
Table 107
Freescale Semiconductor
i.MX25 12x12 Package Ball Map
lists the 12×12 mm package i.MX25 no connect contact assignments.
shows the i.MX25 12×12 package ball map.
Signal Name
NC_BGA_E4
NC_BGA_L4
Table 106. 12×12 mm Package i.MX25 No Connect Contact Assignments
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
Table 107. i.MX25 12×12 Package Ball Map
E4
L4
Contact Assignment
149

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