MC9S08LC36LH Freescale Semiconductor, MC9S08LC36LH Datasheet - Page 20

• Manufacturer Part Number: MC9S08LC36LH
• Description: IC MCU 36K FLASH 2K RAM 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08LC36LH

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LCD, LVD, POR, PWM, WDT
• Number Of I /o: 18
• Program Memory Size: 36KB (36K x 8)
• Program Memory Type: FLASH
• Ram Size: 2.5K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 2x12b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 64-LQFP
• Processor Series: S08LC
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2.5 KB
• Interface Type: I2C/SCI/SPI1/SPI2
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 18
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2-ch x 12-bit
• For Use With: DEMO9S08LC60 - BOARD DEMO FOR 9S08LC60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Section Number
17.4 Register Definition ........................................................................................................................314
A.1 Introduction ...................................................................................................................................323
A.2 Absolute Maximum Ratings ..........................................................................................................323
A.3 Thermal Characteristics .................................................................................................................324
A.4 Electrostatic Discharge (ESD) Protection Characteristics ............................................................325
A.5 DC Characteristics .........................................................................................................................326
A.6 Supply Current Characteristics ......................................................................................................330
A.7 ADC Characteristics ......................................................................................................................333
A.8 LCD Characteristics ......................................................................................................................336
A.9 Internal Clock Generation Module Characteristics .......................................................................339
A.10 AC Characteristics .........................................................................................................................341
A.11 FLASH Specifications ...................................................................................................................347
A.12 EMC Performance .........................................................................................................................348
B.1 Ordering Information ....................................................................................................................351
B.2 Mechanical Drawings ....................................................................................................................351
20
17.4.1
17.4.2
17.4.3
A.9.1 ICG Frequency Specifications ........................................................................................339
A.10.1 Control Timing ...............................................................................................................342
A.10.2 Timer/PWM (TPM) Module Timing ..............................................................................343
A.10.3 SPI Timing ......................................................................................................................344
A.12.1 Radiated Emissions .........................................................................................................348
A.12.2 Conducted Transient Susceptibility ................................................................................349
BDC Registers and Control Bits ...................................................................................314
17.4.1.1 BDC Status and Control Register (BDCSCR) ..............................................315
17.4.1.2 BDC Breakpoint Match Register (BDCBKPT) ............................................316
System Background Debug Force Reset Register (SBDFR) ........................................316
DBG Registers and Control Bits ..................................................................................317
17.4.3.1 Debug Comparator A High Register (DBGCAH) ........................................317
17.4.3.2 Debug Comparator A Low Register (DBGCAL) .........................................317
17.4.3.3 Debug Comparator B High Register (DBGCBH) .........................................317
17.4.3.4 Debug Comparator B Low Register (DBGCBL) ..........................................317
17.4.3.5 Debug FIFO High Register (DBGFH) ..........................................................318
17.4.3.6 Debug FIFO Low Register (DBGFL) ...........................................................318
17.4.3.7 Debug Control Register (DBGC) ..................................................................319
17.4.3.8 Debug Trigger Register (DBGT) ..................................................................320
17.4.3.9 Debug Status Register (DBGS) .....................................................................321
Ordering Information and Mechanical Drawings
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Electrical Characteristics
Appendix A
Appendix B
Title
Freescale Semiconductor
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