C8051F829-GS Silicon Laboratories Inc, C8051F829-GS Datasheet - Page 36
C8051F829-GS
Manufacturer Part Number
C8051F829-GS
Description
IC MCU 8BIT 8KB FLASH 16SOIC
Manufacturer
Silicon Laboratories Inc
Series
C8051F82xr
Datasheet
1.C8051F800DK.pdf
(250 pages)
Specifications of C8051F829-GS
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
13
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
16-SOIC (3.9mm Width)
Processor Series
C8051F8x
Core
8051
Data Bus Width
16 bit
Data Ram Size
256 B
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
13
Number Of Timers
3
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F800DK
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Other names
336-1809-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F829-GS
Manufacturer:
Silicon Laboratories Inc
Quantity:
135
- Current page: 36 of 250
- Download datasheet (2Mb)
C8051F80x-83x
36
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
pad is to be 60 µm minimum, all the way around the pad.
solder paste release.
Components.
Dimension
C
E
X
Y
Table 5.2. QSOP-24 PCB Land Pattern Dimensions
Figure 5.2. QSOP-24 PCB Land Pattern
Rev. 1.0
5.20
0.30
1.50
Min
0.635 BSC
Max
5.30
0.40
1.60
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