DSPIC30F6013-20I/PF Microchip Technology, DSPIC30F6013-20I/PF Datasheet - Page 8
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DSPIC30F6013-20I/PF
Manufacturer Part Number
DSPIC30F6013-20I/PF
Description
IC DSPIC MCU/DSP 132K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F6014-20IPF.pdf
(228 pages)
2.DSPIC30F6014-20IPF.pdf
(22 pages)
3.DSPIC30F6014-20IPF.pdf
(28 pages)
Specifications of DSPIC30F6013-20I/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
132KB (44K x 24)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TQFP, 80-VQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
68
Flash Memory Size
132KB
Supply Voltage Range
2.5V To 5.5V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1AC164314 - MODULE SKT FOR PM3 80PFAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Other names
DSPIC30F601320IPF
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6013-20I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6013-20I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F6011/6012/6013/6014
6. Module: CPU
EXAMPLE 4:
DS80456D-page 8
LOOP1: MOV
LOOP0:
Note:
When using two DO loops in a nested fashion,
terminating the inner-level DO loop by setting the
EDT bit (CORCON<11>) will produce unexpected
results. Specifically, the device may continue
executing code within the outer DO loop forever.
This erratum does not affect the operation of the
MPLAB C30 compiler.
Work around
The application should save the DCOUNT Special
Function Register (SFR) prior to entering the inner
DO loop and restore it upon exiting the inner DO
loop. This work around is shown in Example 4.
Affected Silicon Revisions
A3
X
.include “p30fxxxx.inc”
.......
DO #CNT1, LOOP0
....
PUSH
DO
....
BTSS
BSET
....
....
POP
...
For details on the functionality of
EDT bit, see section 2.9.2.4
in the dsPIC30F Family Reference
Manual.
MOV
B1
X
B2
DCOUNT
#CNT2, LOOP1
Flag, #0
CORCON, #EDT;Terminate inner
W1, W5
DCOUNT
W5, W8
X
SAVE AND RESTORE
DCOUNT
;Outer loop start
;Save DCOUNT
;starts
;DO-loop early
;Inner loop ends
;Restore DCOUNT
;Outer loop ends
;Inner loop
7. Module: Flash Memory
EXAMPLE 5:
__AddressError:
If a device Reset occurs while an Run-Time Self-
Programming (RTSP) operation is ongoing, code
execution after the Reset may lead to an address
error trap.
Work around
The user should define an address error Trap Ser-
vice Routine (TSR), as shown in Example 5, in
order to allow normal code execution to continue.
Affected Silicon Revisions
bclr
bclr
reset
A3
X
B1
X
RCON, #TRAPR
INTCON1, #ADDRERR
B2
X
TRAP SERVICE ROUTINE
© 2010 Microchip Technology Inc.
;Clear the Trap
;Reset Flag Bit
;Address Error
;trap flag bit
;Software reset
;Clear the