PIC16C66-04/SP Microchip Technology, PIC16C66-04/SP Datasheet - Page 4
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PIC16C66-04/SP
Manufacturer Part Number
PIC16C66-04/SP
Description
IC MCU OTP 8KX14 PWM 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC16LC62A-04SP.pdf
(337 pages)
4.PIC16C66-04SO.pdf
(6 pages)
Specifications of PIC16C66-04/SP
Program Memory Type
OTP
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2.5 V to 6 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
0 C
Controller Family/series
PIC16C
No. Of I/o's
22
Ram Memory Size
368Byte
Cpu Speed
4MHz
No. Of Timers
3
Embedded Interface Type
I2C, SPI, UART
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16C66-04/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
PIC16C66-04/SP021
Manufacturer:
MICROCHIP
Quantity:
419
Part Number:
PIC16C66-04/SP021
Manufacturer:
MIC
Quantity:
20 000
SSP MODULE
REVISION HISTORY
Revision A Document (7/2002):
2
Original version (I
C Slave Issue).
Revision B Document (1/2003):
Clarification of original issue to include Restart
conditions. Addition of data sheet clarification 1 (SPI
Mode, CKE bit).
Revision C Document (3/2003):
Addition of data sheet clarification 2 (SPI Slave Mode,
operation).
Revision D Document (9/2004):
2
Updated list of affected devices for silicon issue 1 (I
C
– Slave Mode) and 2 (SSP – SPI, Slave Mode),
2
removed silicon issue 3 (I
C – Slave Mode). Updated
list of affected devices for data sheet clarification 1
(SSP – SPI Mode) and 2 (SSP – SPI Slave Mode).
2
Added data sheet clarification 3 (SSP – I
C Mode).
Revision E Document (7/2006):
Removed silicon issue 2 (SSP – SPI Slave Mode).
Revision F Document (2/2007):
Added four devices to list of devices affected by the
silicon errata and clarified the related language.
© 2007 Microchip Technology Inc.
DS80132F-page 4