EFM32G210F128 Energy Micro, EFM32G210F128 Datasheet - Page 55
EFM32G210F128
Manufacturer Part Number
EFM32G210F128
Description
IC MCU 32BIT 128KB FLASH 32QFN
Manufacturer
Energy Micro
Series
Geckor
Specifications of EFM32G210F128
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
32MHz
Connectivity
EBI/EMI, I²C, IrDA, SmartCard, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.8 V
Data Converters
A/D 4x12b, D/A 1x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
Processor Series
EFM32G210
Core
ARM Cortex-M3
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
I2C, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
24
Number Of Timers
2
Operating Supply Voltage
1.8 V to 3.8 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
914-1011-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EFM32G210F128-QFN32
Manufacturer:
EPCOS
Quantity:
34 000
Company:
Part Number:
EFM32G210F128-QFN32T
Manufacturer:
SILICON
Quantity:
1 000
7.4 Revision 1.00
7.5 Revision 0.85
7.6 Revision 0.83
7.7 Revision 0.82
7.8 Revision 0.81
2010-12-17 - d0004_Rev1.20
April 23rd, 2010
ADC_VCM line removed.
Added pinout illustration and additional pinout table.
Changed "Errata" chapter. Errata description moved to separate document.
Document changed status from "Preliminary".
Updated "Electrical Characteristics" chapter.
February 19th, 2010
Renamed DBG_SWV pin to DBG_SWO.
January 25th, 2010
Updated errata section.
Specified flash word width in Section 3.7 (p. 18)
Added Capacitive Sense Internal Resistor values in Section 3.12 (p. 42) .
December 9th, 2009
Updated conctact information.
ADC current consumption numbers updated in Section 3.10 (p. 31)
November 20th, 2009
Section 2.1.21 (p. 5) updated.
Section 3.1 (p. 8) updated.
Storage temperature in Section 3.2 (p. 8) updated.
Temperature coefficient of band-gap reference in Section 3.6 (p. 17) added.
Erase times in Section 3.7 (p. 18) updated.
Definitions of DNL and INL added in Figure 3.27 (p. 35) and Figure 3.28 (p. 35) .
Current consumption of digital peripherals added in Section 3.14 (p. 44) .
Updated errata section.
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