T89C51CC02CA-TDSIM Atmel, T89C51CC02CA-TDSIM Datasheet - Page 148

• Manufacturer Part Number: T89C51CC02CA-TDSIM
• Description: IC 8051 MCU FLASH 16K 24SOIC
• Manufacturer: Atmel
• Series: AT89C CANr

Specifications of T89C51CC02CA-TDSIM

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-SOIC (7.5mm Width)
• For Use With: AT89STK-06 - KIT DEMOBOARD 8051 MCU W/CAN
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: T89C51CC02CATDSIM

148
STANDARD NOTES FOR PQFP/ VQFP / TQFP / DQFP
AT/T89C51CC02
1/ CONTROLLING DIMENSIONS : INCHES
2/ ALL DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y 14.5M -
1982.
3/ "D1 AND E1" DIMENSIONS DO NOT INCLUDE MOLD PROTUSIONS.
THE TOP PACKAGE BODY SIZE MAY BE SMALLER THAN THE BOTTOM
4/ DATUM PLANE "H" LOCATED AT MOLD PARTING LINE AND
COINCIDENT WITH LEAD, WHERE LEAD EXITS PLASTIC BODY AT
5/ DATUM "A" AND "D" TO BE DETERMINED AT DATUM PLANE H.
6/ DIMENSION " f " DOES NOT INCLUDE DAMBAR PROTUSION ALLOWABLE
" f " DIMENSION AT MAXIMUM MATERIAL CONDITION .
DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT.
MOLD PROTUSIONS SHALL NOT EXCEED 0.25 mm (0.010 INCH).
PACKAGE BODY SIZE BY AS MUCH AS 0.15 mm.
BOTTOM OF PARTING LINE.
DAMBAR PROTUSION SHALL BE 0.08mm/.003" TOTAL IN EXCESS OF THE
4126L–CAN–01/08