PIC16F722-I/ML Microchip Technology, PIC16F722-I/ML Datasheet - Page 216
![IC PIC MCU FLASH 2KX14 28-QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
PIC16F722-I/ML
Manufacturer Part Number
PIC16F722-I/ML
Description
IC PIC MCU FLASH 2KX14 28-QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.AC164112.pdf
(302 pages)
2.PIC16F722-ISS.pdf
(8 pages)
3.PIC16F722-ISS.pdf
(10 pages)
4.PIC16F722-ISS.pdf
(32 pages)
5.PIC16F722-ISS.pdf
(2 pages)
6.PIC16F722-ISS.pdf
(8 pages)
Specifications of PIC16F722-I/ML
Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
25
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Controller Family/series
PIC16F
No. Of I/o's
25
Ram Memory Size
128Byte
Cpu Speed
20MHz
No. Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- AC164112 PDF datasheet
- PIC16F722-ISS PDF datasheet #2
- PIC16F722-ISS PDF datasheet #3
- PIC16F722-ISS PDF datasheet #4
- PIC16F722-ISS PDF datasheet #5
- PIC16F722-ISS PDF datasheet #6
- Current page: 216 of 302
- Download datasheet (5Mb)
PIC16F72X/PIC16LF72X
23.3
DS41341E-page 216
PIC16LF72X
PIC16F72X
D020
D020
D021
D021
D021A
D021A
D022
D022
D026
D026
Note 1:
Param
No.
2:
3:
4:
5:
†
DC Characteristics: PIC16F72X/PIC16LF72X-I/E (Power-Down)
Power-down Base Current (I
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
The peripheral current is the sum of the base I
enabled. The peripheral Δ current can be determined by subtracting the base I
values should be used when calculating total current consumption.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
Fixed Voltage Reference is automatically enabled whenever the BOR is enabled
A/D oscillator source is F
0.1 μF capacitor on V
Device Characteristics
CAP
RC
(RA0).
PD
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
)
(2)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Typ†
0.02
0.08
4.3
5.5
0.5
0.8
6.5
7.5
8.5
8.5
7.5
0.6
1.8
4.5
23
25
26
23
25
—
—
5
6
6
7
DD
+85°C
Max.
10.2
10.5
13.5
14.5
12.5
13.5
11.8
11.1
0.7
1.0
1.7
2.5
3.0
16
14
14
44
45
60
—
12
—
42
46
or I
2
PD
and the additional current consumed when this peripheral is
+125°C
Max.
16.4
16.8
18.7
3.9
4.3
4.1
4.8
17
18
21
19
20
48
55
70
22
49
50
—
—
—
—
—
—
—
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
Units
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
A
A
A
A
V
≤ +85°C for industrial
≤ +125°C for extended
≤ +85°C for industrial
≤ +125°C for extended
1.8
3.0
1.8
3.0
5.0
1.8
3.0
1.8
3.0
5.0
1.8
3.0
1.8
3.0
5.0
1.8
3.0
1.8
3.0
5.0
1.8
3.0
1.8
3.0
5.0
DD
DD
DD
.
or I
PD
WDT, BOR, FVR, and T1OSC
disabled, all Peripherals Inactive
WDT, BOR, FVR, and T1OSC
disabled, all Peripherals Inactive
LPWDT Current (Note 1)
LPWDT Current (Note 1)
FVR current (Note 1. Note 3)
FVR current (Note 1, Note 3,
Note 5)
BOR Current (Note 1, Note 3)
BOR Current (Note 1, Note 3,
Note 5)
T1OSC Current (Note 1)
T1OSC Current (Note 1)
© 2009 Microchip Technology Inc.
current from this limit. Max
Conditions
Note
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