LQH32MN1R0M23L Murata Electronics North America, LQH32MN1R0M23L Datasheet
LQH32MN1R0M23L
Specifications of LQH32MN1R0M23L
Available stocks
Related parts for LQH32MN1R0M23L
LQH32MN1R0M23L Summary of contents
Page 1
Inductor for Power Lines (Power Inductor) 1. Standard Land Pattern Dimensions A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip inductor (chip coil) electrode. Series LQM18F/18P ...
Page 2
Standard Soldering Conditions (1) Soldering method Chip inductor (Chip coils) can be flow or reflow soldered. Please contact Murata regarding other soldering methods. As for LQH2MC/55D/66S/32P/3NP/44P/5BP/55P, LQW15C/18C series, please use reflow soldering. (2) Soldering profile "Flow Soldering profile (Sn-3.0Ag-0.5Cu ...
Page 3
Inductor for Power Lines (Power Inductor) (3) Reworking with Soldering Iron Preheating at 150 C for 1 minute is required. Do not directly touch the ceramic element with the tip of the soldering iron. The reworking soldering conditions are as ...
Page 4
Amount of Solder Paste Excessive solder causes electrode corrosion, while insufficient solder causes low electrode bonding strength. Adjust the amount of solder paste as shown on the right so that solder is applied. " Guideline of solder paste thickness ...