S202S02F Sharp Microelectronics, S202S02F Datasheet
S202S02F
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S202S02F Summary of contents
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... S102S02 Series and S202S02 Series Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector and a main output Triac. These devices are ideally suited for controlling high voltage AC loads with solid state reliability while providing 4.0kV isolation (V (rms) ) from input to iso output. ■ ...
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Internal Connection Diagram Zero Crossing Circuit ■ Outline Dimensions S102S02 ±0.2 18.5 ±0.3 16.4 ±0.2 φ3.2 Common to pin No.1 Common to pin No.1 CSA mark Epoxy resin S102S02 UL mark Model No. ∗ 8A125VAC ...
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Date code (2 digit) 1st digit Year of production A.D. A.D Mark Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Forward current Input Reverse voltage RMS ON-state current Peak one cycle surge current Repetitive S102S02 peak OFF-state voltage S202S02 Output Non-Repetitive S102S02 peak OFF-state voltage S202S02 Critical rate of rise of ON-state current Operating frequency ...
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... Model Line-up (1) (Lead-free terminal components) Case Shipping Package 200pcs/case S102S02F Model No. S202S02F ■ Model Line-up (2) (Lead solder plating components) Case Shipping Package 200pcs/case S102S02 Model No. S202S02 Please contact a local SHARP sales representative to see the actual status of the production. I [mA DRM ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.2 RMS ON-state Current vs. Ambient Temperature (4) (3) (2) ( (6) 3 ...
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Fig.5 Surge Current vs. Power-on Cycle 100 Power-on cycle (Times) Fig.7 Minimum Trigger Current vs. Ambient Temperature =30Ω − ...
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Design Considerations ● Recommended Operating Conditions Parameter Input signal current at ON state Input Input signal current at OFF state S102S02 Load supply voltage S202S02 Output Load supply current Frequency Operating temperature ∗ See Fig.2 about derating ...
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Make sure there are no warps or bumps on the heat sink, insulation sheet and device surface. (b) Make sure there are no metal dusts or burrs attached onto the heat sink, insulation sheet and device sur- face. (c) ...
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Manufacturing Guidelines ● Soldering Method Flow Soldering (No solder bathing) Flow soldering should be completed below 260˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please solder within one time. Other ...
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Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning ...
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Package specification Package materials Packing case : Corrugated cardboard Partition : Corrugated cardboard Pad : Corrugated cardboard Cushioning material : Polyethylene Molt plane : Urethane Package method The product should be located after the packing case is partitioned and ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...