LX1555MY Microsemi Analog Mixed Signal Group, LX1555MY Datasheet - Page 2
LX1555MY
Manufacturer Part Number
LX1555MY
Description
IC PWM CURRENT MODE 8.4V 8DIP
Manufacturer
Microsemi Analog Mixed Signal Group
Datasheet
1.LX1554CM.pdf
(18 pages)
Specifications of LX1555MY
Pwm Type
Current Mode
Number Of Outputs
1
Frequency - Max
500kHz
Duty Cycle
48%
Voltage - Supply
11 V ~ 25 V
Buck
Yes
Boost
Yes
Flyback
Yes
Inverting
No
Doubler
No
Divider
No
Cuk
No
Isolated
Yes
Operating Temperature
-55°C ~ 125°C
Package / Case
8-DIP
Frequency-max
500kHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
LX1552/3/4/5
2
Supply Voltage (Low Impedance Source) .................................................................. 30V
Supply Voltage (I
Output Current ............................................................................................................. ±1A
Output Energy (Capacitive Load) ................................................................................ 5µJ
Analog Inputs (Pins 2, 3) ........................................................................... -0.3V to +6.3V
Error Amp Output Sink Current ............................................................................... 10mA
Power Dissipation at T
Operating Junction Temperature
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................ 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
M PACKAGE:
DM PACKAGE:
D PACKAGE:
Y PACKAGE:
PW PACKAGE:
Junction Temperature Calculation: T
The
All of the above assume no ambient airflow
Pb-free / RoHS Peak Package Solder Reflow Temp. (40 second max. exposure)................ 260°C (+0, -5)
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
Ceramic (Y Package) ............................................................................................ 150°C
Plastic (M, DM, D, PW Packages) ........................................................................ 150°C
JA
numbers are guidelines for the thermal performance of the device/pc-board system.
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
A B S O L U T E M A X I M U M R AT I N G S
CC
< 30mA) ......................................................................... Self Limiting
A
= 25°C (DIL-8) ...................................................................... 1W
T H E R M A L D ATA
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
J
U
= T
LTRA
A
+ (P
P
-L
R O D U C T I O N
D
OW
x
JA
JA
JA
JA
JA
JA
S
).
TART
-U
P
C
URRENT
(Note 1)
D
, C
A T A
URRENT
165°C/W
120°C/W
130°C/W
144°C/W
95°C/W
S
-M
H E E T
ODE
PWM
M Package RoHS / Pb-free 100% Matte Tin Lead Finish
COMP
RoHS / Pb-free 100% Matte Tin Lead Finish
R
RoHS / Pb-free 100% Matte Tin Lead Finish
N.C.
N.C.
N.C.
I
N.C.
N.C.
N.C.
SENSE
T
RoHS / Pb-free 100% Matte Tin Lead Finish
/C
V
PACKAGE PIN OUTS
COMP
FB
T
R
COMP
N.C.
N.C.
I
N.C.
SENSE
T
R
/C
COMP
V
I
SENSE
T
R
/C
V
FB
I
T
T
SENSE
/C
V
M & Y PACKAGE
FB
T
FB
DM PACKAGE
PW PACKAGE
T
1
2
3
4
5
6
7
8
9
10
D PACKAGE
(Top View)
(Top View)
(Top View)
(Top View)
1
2
3
4
5
6
7
1
2
3
4
1
2
3
4
14
13
12
11
10
8
7
6
5
9
8
8
7
6
5
20
19
18
17
16
15
14
13
12
11
V
V
OUTPUT
GND
REF
CC
V
V
OUTPUT
GND
V
N.C.
V
V
OUTPUT
GND
PWR GND
Copyright © 1994
REF
CC
REF
CC
C
Rev. 1.0b
N.C.
N.C.
V
N.C.
V
V
OUTPUT
GND
PWR GND
N.C.
REF
CC
C