NCP380HMU20AATBG ON Semiconductor, NCP380HMU20AATBG Datasheet - Page 22
NCP380HMU20AATBG
Manufacturer Part Number
NCP380HMU20AATBG
Description
Power Switch ICs - Power Distribution OVER CURRENT PROTECTION
Manufacturer
ON Semiconductor
Datasheet
1.NCP380HMU20AATBG.pdf
(23 pages)
Specifications of NCP380HMU20AATBG
Product Category
Power Switch ICs - Power Distribution
Rohs
yes
On Resistance (max)
75 mOhms
On Time (max)
4 ms
Off Time (max)
3 ms
Operating Supply Voltage
2.5 V to 5.5 V
Supply Current (max)
90 uA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
UDFN-6
Current Limit
2 A
Maximum Power Dissipation
830 mW
Minimum Operating Temperature
- 40 C
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
1.0
C A B
0.037
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
J
CASE 483−02
K
ISSUE H
TSOP−5
0.074
DETAIL Z
1.9
22
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
A
B
C
D
G
H
K
M
J
L
S
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_