PCF26100ET PHILIPS [NXP Semiconductors], PCF26100ET Datasheet - Page 24

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PCF26100ET

Manufacturer Part Number
PCF26100ET
Description
Bluetooth Adapter IC
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
Philips Semiconductors
12 PACKAGE OUTLINE
2001 Jun 19
TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 5 x 5 x 0.8 mm
Bluetooth Adapter IC
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT641-1
max.
ball A1
index area
1.12
A
0.28
0.16
A 1
H
G
D
C
B
A
E
F
0.84
0.76
A 2
e
1
IEC
0.37
0.27
b
2
3
5.1
4.9
D
4
e 1
D
b
5
5.1
4.9
E
MO-211
JEDEC
6
0
0.5
7
e
REFERENCES
w
8
M
3.5
e 1
v
0.15
M
e
B
v
scale
EIAJ
2.5
24
B
A
E
e 1
0.1
w
v
M
0.12
A
y
0.1
y 1
5 mm
A
A 2
A 1
y 1 C
detail X
PROJECTION
EUROPEAN
Preliminary specification
X
C
y
PCF26100
ISSUE DATE
00-10-10
SOT641-1

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