PESD3V3X1BL NXP Semiconductors, PESD3V3X1BL Datasheet - Page 8

Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in aleadless ultra small Surface-Mounted Device (SMD) plastic package designed to protectone signal line from the damage caused by ESD and other transients

PESD3V3X1BL

Manufacturer Part Number
PESD3V3X1BL
Description
Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in aleadless ultra small Surface-Mounted Device (SMD) plastic package designed to protectone signal line from the damage caused by ESD and other transients
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PESD3V3X1BL
Manufacturer:
JXND
Quantity:
20 000
NXP Semiconductors
11. Soldering
PESD3V3X1BL_1
Product data sheet
Fig 7.
0.9
Reflow soldering is the only recommended soldering method.
Reflow soldering footprint PESD3V3X1BL (SOD882)
(2 )
(2 )
0.3
0.4
Rev. 01 — 6 January 2009
1.3
0.7
Ultra low capacitance bidirectional ESD protection diode
(2 )
0.6
R0.05 (8 )
(2 )
0.7
PESD3V3X1BL
Dimensions in mm
© NXP B.V. 2009. All rights reserved.
solder lands
solder resist
solder paste
occupied area
sod882_fr
8 of 11

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