MT47H16M16FG-3:B Micron Technology Inc, MT47H16M16FG-3:B Datasheet - Page 17
MT47H16M16FG-3:B
Manufacturer Part Number
MT47H16M16FG-3:B
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H16M16FG-3B.pdf
(128 pages)
Specifications of MT47H16M16FG-3:B
Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
215mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H16M16FG-3:B
Manufacturer:
MICRON
Quantity:
1 000
Company:
Part Number:
MT47H16M16FG-3:B
Manufacturer:
ST
Quantity:
1 489
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- Download datasheet (10Mb)
Packaging
Package Dimensions
Figure 8: 84-Ball, FBGA Package (8mm x 14mm) – x16
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
Solder ball material:
Pb-free – (SAC305) SnAgCu
Pb – (Eutectic) SnPbAg
Dimensions apply to solder
balls post-reflow.
Seating plane
84X Ø0.45
0.12 C
0.80 TYP
Note:
C
1. All dimensions are in millimeters.
8.0 ±0.15
0.80
TYP
6.4
C L
C L
17
11.2
0.8 ±0.1
Ball A1 ID
14.0 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
©2003 Micron Technology, Inc. All rights reserved.
Ball A1 ID location
Packaging
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