MT47H16M16FG-3:B Micron Technology Inc, MT47H16M16FG-3:B Datasheet - Page 118
MT47H16M16FG-3:B
Manufacturer Part Number
MT47H16M16FG-3:B
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H16M16FG-3B.pdf
(128 pages)
Specifications of MT47H16M16FG-3:B
Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
215mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H16M16FG-3:B
Manufacturer:
MICRON
Quantity:
1 000
Company:
Part Number:
MT47H16M16FG-3:B
Manufacturer:
ST
Quantity:
1 489
- Current page: 118 of 128
- Download datasheet (10Mb)
Figure 75: PRECHARGE Command-to-Power-Down Entry
Figure 76: LOAD MODE Command-to-Power-Down Entry
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
Notes:
Note:
Command
Command
Address
Address
1. The earliest precharge power-down entry may occur is at T2, which is 1 ×
1. Valid address for LM command includes MR, EMR, EMR(2), and EMR(3) registers.
2. All banks must be in the precharged state and
3. The earliest precharge power-down entry is at T3, which is after
CK#
CKE
CK#
A10
CKE
CK
PRECHARGE command. Precharge power-down entry occurs prior to
isfied.
CK
Valid
T0
Valid
T0
t RP 2
Valid 1
LM
T1
Single bank
Valid
All banks
118
PRE
T1
vs
1 x
t MRD
t
CK
NOP
Micron Technology, Inc. reserves the right to change products or specifications without notice.
T2
Power-down 1
256Mb: x4, x8, x16 DDR2 SDRAM
entry
NOP
T2
t
Power-down 3
RP met prior to issuing LM command.
entry
NOP
T3
t
CKE (MIN)
T3
Power-Down Mode
©2003 Micron Technology, Inc. All rights reserved.
t CKE (MIN)
Don’t Care
t
MRD is satisfied.
T4
t
RP (MIN) being sat-
Don’t Care
t
CK after the
Related parts for MT47H16M16FG-3:B
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
IC SDRAM 64MBIT 133MHZ 54TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 64MBIT 5.5NS 86TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 64MBIT 200MHZ 86TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 64MBIT 133MHZ 54TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 133MHZ 54TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 256MBIT 133MHZ 90VFBGA
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 133MHZ 54TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 256MBIT 133MHZ 54TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC DDR SDRAM 512MBIT 6NS 66TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 167MHZ 86TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 143MHZ 86TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
SDRAM 256M-BIT 1.8V 54-PIN VFBGA
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 143MHZ 86TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 125MHZ 54VFBGA
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 125MHZ 54VFBGA
Manufacturer:
Micron Technology Inc
Datasheet: