MT47H16M16BG-3 Micron Technology Inc, MT47H16M16BG-3 Datasheet - Page 17

• Manufacturer Part Number: MT47H16M16BG-3
• Manufacturer: Micron Technology Inc

Specifications of MT47H16M16BG-3

• Lead Free Status / Rohs Status: Compliant

Packaging
Package Dimensions
Figure 8: 84-Ball, FBGA Package (8mm x 14mm) – x16
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
Solder ball material:
Pb-free – (SAC305) SnAgCu
Pb – (Eutectic) SnPbAg
Dimensions apply to solder
balls post-reflow.
Seating plane
84X Ø0.45
0.12 C
0.80 TYP
Note:
C
1. All dimensions are in millimeters.
8.0 ±0.15
0.80
TYP
6.4
C L
C L
17
11.2
0.8 ±0.1
Ball A1 ID
14.0 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
©2003 Micron Technology, Inc. All rights reserved.
Ball A1 ID location
Packaging