MT48H4M32LFB5-6:K TR Micron Technology Inc, MT48H4M32LFB5-6:K TR Datasheet - Page 13
MT48H4M32LFB5-6:K TR
Manufacturer Part Number
MT48H4M32LFB5-6:K TR
Description
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet
1.MT48H4M32LFB5-6K_TR.pdf
(86 pages)
Specifications of MT48H4M32LFB5-6:K TR
Organization
4Mx32
Density
128Mb
Address Bus
14b
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
100mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
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- Download datasheet (3Mb)
Package Dimensions
Figure 5: 54-Ball VFBGA (8mm x 8mm)
PDF: 09005aef832ff1ea
128mb_mobile_sdram_y35M.pdf - Rev. G 10/09 EN
Dimensions apply
to solder balls
post-reflow. Pre-
reflow balls are
Ø0.42 on Ø0.4
SMD ball pads.
Exposed plated
features in all
corners are floating
nonbiased metal.
Seating
plane
54X Ø0.45
6.4
0.1 A
0.8 TYP
3.2
Note:
A
9
8
1. All dimensions are in millimeters.
3.2
7
8 ±0.1
6.4
4 ±0.05
3
2
1
128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM
A
B
C
D
E
F
G
H
J
0.8 TYP
Ball A1 ID
4 ±0.05
13
0.65 ±0.05
8 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID
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