MT48LC16M16A2TG75ITTR Micron Technology Inc, MT48LC16M16A2TG75ITTR Datasheet - Page 17
MT48LC16M16A2TG75ITTR
Manufacturer Part Number
MT48LC16M16A2TG75ITTR
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC16M16A2TG75ITTR.pdf
(92 pages)
Specifications of MT48LC16M16A2TG75ITTR
Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Not Compliant
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Figure 8: 60-Ball FBGA "FB" (8mm x 16mm) (x4, x8)
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. PRE-
REFLOW DIAMETER
IS 0.42 ON A 0.33 NSMD
BALL PAD.
16.00 ±0.10
60X Ø 0.45
8.00 ±0.05
5.60
Notes:
BALL
A8
0.155 ±0.013
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.33mm ±0.025mm.
3. Topside part-marking decoder is available at www.micron.com/decoder.
0.850 ±0.05
2.40 ±0.05
8.00 ±0.10
2.80
0.80
TYP
CTR
5.60
4.00 ±0.05
C L
A
BALL A1
0.80
TYP
BALL #1 ID
11.20
17
SEATING PLANE
0.10 A
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.20 MAX
SOLDER BALL MATERIAL:
SUBSTRATE:
ENCAPSULATION MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn. 3% Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
256Mb: x4, x8, x16 SDRAM
Package Dimensions
© 1999 Micron Technology, Inc. All rights reserved.
BALL #1 ID
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