RD28F3208C3B90 Intel, RD28F3208C3B90 Datasheet - Page 68
RD28F3208C3B90
Manufacturer Part Number
RD28F3208C3B90
Description
Manufacturer
Intel
Datasheet
1.RD28F3208C3B90.pdf
(75 pages)
Specifications of RD28F3208C3B90
Operating Supply Voltage (max)
3.3V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant
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C3 SCSP Flash Memory
Appendix F Mechanical and Shipping Media Details
F.8
Table 35.
26 Aug 2005
68
Package Height
Ball Height
Package Body Thickness
Ball Lead Diameter
Package Body Length – 16-Mbit/2-Mbit
Package Body Length –
32-Mbit/4-Mbit, 16-Mbit/4-Mbit
Package Body Length –
32-Mbit/8-Mbit
Package Body Width –
16-Mbit/2-Mbit, 16-Mbit/4-Mbit,
32-Mbit/4-Mbit, 32-Mbit/8-Mbit
Mechanical Specification
Note:
Packaging Specifications (0.18µm and 0.25µm) (Sheet 1 of 2)
E
Intel
Shaded pins indicate upper address balls for 64-Mbit and 128-Mbit devices. In all Flash and SRAM
combinations, 66 balls are populated on lower density devices. (Upper address balls are not populated).
A
B
C
D
E
F
G
H
®
1
Advanced+ Boot Block Flash Memory (C3) SCSP Family
Index
A1
2
3
A1
Order Number: 252636, Revision: 004
4
A2
5
Top View - Ball Down
6
D
7
8
Sym
A1
A2
9
D
A
b
E
10
11
13.900
11.900
0.250
0.350
9.900
7.900
12
Min
Millimeters
12.000
14.000
12
0.400
10.00
8.000
0.960
Nom
11
10
10.100
12.100
14.100
9
1. 400
0.450
8.100
Max
Bottom View - Ball Up
8
e
7
A
6
0.0098
0.0138
0.3898
0.4685
0.5472
0.3110
Min
5
4
Y
3
Inches
0.0157
0.3937
0.4724
0.5512
0.3150
0.0378
Nom
2
1
Datasheet
S2
A
B
C
D
E
F
G
H
0.0551
0.0177
0.3976
0.4764
0.5551
0.3189
Max
b
S1
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