S71PL032J04BAW0B0 Spansion Inc., S71PL032J04BAW0B0 Datasheet - Page 18
S71PL032J04BAW0B0
Manufacturer Part Number
S71PL032J04BAW0B0
Description
Manufacturer
Spansion Inc.
Datasheet
1.S71PL032J04BAW0B0.pdf
(24 pages)
Specifications of S71PL032J04BAW0B0
Operating Supply Voltage (max)
3.1V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
TLA064—64-ball Fine-Pitch Ball Grid Array (FBGA) 8 x 11.6mm Package
16
PACKAGE
SYMBOL
SD / SE
JEDEC
A
D x E
MD
ME
A1
A2
D1
E1
eE
eD
φb
D
A
E
n
CORNER
0.15
(2X)
PIN A1
A2
A1
C
C1,C2,C9,C10,D1,D10,E1,E10,
H1,H10,J1,J10,K1,K2,K9,K10
F1,F5,F6,F10,G1,G5,G6,G10
M2,M3,M4,M5,M6,M7,M8,M9
0.17
0.81
0.35
B1,B2,B3,B4,B7,B8,B9,B10
MIN
A2,A3,A4,A5,A6,A7,A8,A9
---
L1,L2,L3,L4,L7,L8,L9,L10
11.60 mm x 8.00 mm
64X
INDEX MARK
0.15
0.08
11.60 BSC.
PACKAGE
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
TLA 064
10
6
NOM
0.40
N/A
b
12
10
64
---
---
---
M C A B
M C
MAX
1.20
0.97
0.45
---
SIDE VIEW
TOP VIEW
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
A d v a n c e
S71PL-J Based MCPs
C
A
0.15
(2X)
E
B
C
eE
0.20
0.08
I n f o r m a t i o n
10
eD
C
C
9
8
7
6
5
4
3
2
1
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M
L
K
SD
J
7
BOTTOM VIEW
H
G
D1
F
E
D C
B
S71PL-J_00_B3 March 17, 2006
A
SE
CORNER
PIN A1
3352 \ 16-038.22a
7
E1