MPC562MZP56 Freescale Semiconductor, MPC562MZP56 Datasheet - Page 534

IC MPU 32BIT 56MHZ PPC 388-PBGA

MPC562MZP56

Manufacturer Part Number
MPC562MZP56
Description
IC MPU 32BIT 56MHZ PPC 388-PBGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheet

Specifications of MPC562MZP56

Core Processor
PowerPC
Core Size
32-Bit
Speed
56MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
64
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
388-BGA
Processor Series
MPC5xx
Core
PowerPC
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
SCI, SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
56
Number Of Timers
22
Operating Supply Voltage
2.6 V to 5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 32 Channel)
For Use With
MPC564EVB - KIT EVAL FOR MPC561/562/563/564
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC562MZP56
Manufacturer:
FREESCAL
Quantity:
204
Part Number:
MPC562MZP56
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC562MZP56
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MPC562MZP56
Manufacturer:
FREESCALE
Quantity:
7 699
Company:
Part Number:
MPC562MZP56
Quantity:
1 500
Part Number:
MPC562MZP56R2
Manufacturer:
RFT
Quantity:
1 441
Part Number:
MPC562MZP56R2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
QADC64E Legacy Mode Operation
The problem of how and when to combine digital and analog grounds arises from the large transients
which the digital ground must handle. If the digital ground is not able to handle the large transients, the
current from the large transients can return to ground through the analog ground. It is the excess current
overflowing into the analog ground which causes performance degradation by developing a differential
voltage between the true analog ground and the microcontroller’s ground signal. The end result is that the
ground observed by the analog circuit is no longer true ground and often ends in skewed results.
Two similar approaches designed to improve or eliminate the problems associated with grounding excess
transient currents involve star-point ground systems. One approach is to star-point the different grounds at
the power supply origin, thus keeping the ground isolated. Refer to
Another approach is to star-point the different grounds near the analog ground signal on the
microcontroller by using small traces for connecting the non-analog grounds to the analog ground. The
small traces are meant only to accommodate DC differences, not AC transients.
Other suggestions for PCB layout in which the QADC64E is employed include:
The analog ground should be isolated from the digital ground. This can be done by cutting a separate
ground plane for the analog ground
13-70
Analog ground must be low impedance to all analog ground points in the circuit.
Bypass capacitors should be as close to the power signals as possible.
Non-minimum traces should be utilized for connecting bypass capacitors and filters to their
corresponding ground/power points.
Distance for trace runs should be minimized where possible
This star-point scheme still requires adequate grounding for digital and
analog subsystems in addition to the star-point ground.
MPC561/MPC563 Reference Manual, Rev. 1.2
NOTE
Figure
13-51.
Freescale Semiconductor

Related parts for MPC562MZP56